Abstract: In low-Ag Cu matrix alloys, the presence of coarse discontinuous precipitates may limit strength. We demonstrated that discontinuous precipitation was suppressed, and continuous precipitation was enhanced by the doping of Cu-6 wt%Ag with Sc. A high-volume fraction of continuous precipitates, which nucleated on {111} planes, led to a 55 MPa increase in strength, with only a slight decrease in electrical conductivity. The addition of Sc inhibited the nucleation of discontinuous precipitates by causing the Sc and the Ag to co-segregate onto grain boundaries, thus forming a thin intermetallic compound layer between grains. After deformation, both discontinuous and continuous precipitates were drawn into Ag fibers. The combination of deformation strain and doping caused an increase in density and a decrease in the diameter of Ag fibers, resulting in about 205 MPa increase in doped samples when the deformation strain reached 4.9. The thinner, denser Ag fibers in the doped samples also caused higher electron scattering at interfaces, leading to electrical conductivity that was 11% IACS lower than in non-doped samples. For reference, 100% IACS (International Annealed Copper Standard) is equivalent to 1.7241μΩ cm.

Key words: Sc doping, Grain boundary segregation, Precipitation, Strength, Electrical conductivity, Plastic deformation