Growth kinetics of interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal

doi:10.1016/j.jmst.2021.03.031

Abstract

Abstract:

In the present investigation, the growth kinetics of interfacial reaction layer products between cubic boron nitride (CBN) and Cu-Sn-Ti filler metal has been thoroughly investigated. Detailed morphological and compositional features of respective compounds have been demonstrated for a wide brazing temperature ranging from 1153 K to 1223 K. It is found that within 30 minutes brazing holding time, the reaction layer growth is largely determined by the population of TiN via effective Ti diffusion with an activation energy of 223.51 kJ/mol, leading to parabolic growth patterns. It is further revealed that TiN grows both in axial and length dimensions, which eventually extends to the forefront and covers the reaction layer.

Key words: Cubic boron nitride, Cu-Sn-Ti, Interfacial reaction layer, Activation energy

Yonggang Fan, Cong Wang. Growth kinetics of interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal[J]. J. Mater. Sci. Technol., 2021, 92: 69-74.

Figures/Tables 5

Fig. 1. Relationship between standard Gibbs free energy and different brazing temperatures of the possible chemical reactions occuring at the CNB/Cu-Sn-Ti interface

Fig. 2. Typical interfacial microstructure and EDS (energy dispersive spectroscopy) elemental mapping images and line scans analysis of CBN/Cu-Sn-Ti composites with different brazing temperatures for 30 minutes: (a) 1153 K, (b) magnified image of (a), (c) line scanning image of (b); (d) 1173 K, (e) magnified image of (d), (f) line scanning image of (e); (g) 1193 K, (h) magnified image of (g), (i) line scanning image of (h); (j) 1223 K, (k) magnified image of (j), (l) line scanning image of (k). The distribution of green, blue, red, cyan and magenta lines represents the trend of Cu, Sn, Ti, N, B at the interface.

Fig. 3. (a) TEM bright field (BF) micrograph showing the interfacial microstructure between CBN and Cu-Sn-Ti at 1223 K (30 minutes), and (b), (c) and (d) are selected area diffraction patterns of red, yellow and green dashed circle areas, respectively.

Fig. 4. Typical morphologies of newly formed compounds on the surface of CBN grains brazed at 1153 K to 1223 K with holding time from 0 to 30 minutes: (a)-(d) 1153 K, 0-30 minutes; (e)-(h) 1173 K, 0-30 minutes; (i)-(l) 1193 K, 0-30 minutes and (m)-(p) 1223 K, 0-30 minutes.

Fig. 5. Relationship between thickness of reaction layer and brazing time at different brazing temperatures. (a) Curves of reaction layer thickness as a function of holding time; (b) effect of brazing temperature on the growth factor of the reaction layer.

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