Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

J Mater Sci Technol ›› 2010, Vol. 26 ›› Issue (3): 200-205.

• Thin Film and Coatings • Previous Articles Next Articles

Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

Wei Liu, Lei Zhang, J.K. Shang

1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA

Received:2008-12-08 Revised:2009-02-20 Online:2010-03-28 Published:2010-03-22
Supported by:
the National Natural Science Foundation of China (No. 50501022)
the National Basic Research Program of China (No. 2004CB619306)

Abstract

Abstract:

The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere. Dewetting of liquid solder was found to depend strongly on the copper film thickness and preceded by spalling of Cu6Sn5 intermetallic compounds. However, the loss of interfacial bonding by spalling was not sufficient to cause immediate dewetting of solder drops if the wetting tip was still strongly bonded to the copper film. By introducing a pinning force on the wetting front, a sufficient condition was found from a force balance analysis for dewetting of the liquid solder drop, in general agreement with the experimental results.

Key words: Dewetting, Solder, Spalling, Film thickness

Wei Liu Lei Zhang J.K. Shang. Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films[J]. J Mater Sci Technol, 2010, 26(3): 200-205.

[1]	Anil Kunwar, Lili An, Jiahui Liu, Shengyan Shang, Peter Råback, Haitao Ma, Xueguan Song. A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering [J]. J. Mater. Sci. Technol., 2020, 50(0): 115-127.
[2]	Mingna Wang, Chuang Qiao, Xiaolin Jiang, Long Hao, Xiahe Liu. Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere [J]. J. Mater. Sci. Technol., 2020, 51(0): 40-53.
[3]	F.Q. Lang, H. Yamaguchi, H. Nakagawa, H. Sato. Solid-State Interfacial Reaction between Eutectic Au-Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression [J]. J. Mater. Sci. Technol., 2015, 31(5): 445-452.
[4]	M.L. Huang, F. Yang. Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints [J]. J. Mater. Sci. Technol., 2015, 31(3): 252-256.
[5]	M.L. Huang, Z.J. Zhang, H.T. Ma, L.D. Chen. Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration [J]. J. Mater. Sci. Technol., 2014, 30(12): 1235-1242.
[6]	Jing Han, Hongtao Chen, Mingyu Li, Chunqing Wang. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples [J]. J. Mater. Sci. Technol., 2013, 29(5): 471-479.
[7]	Qian Wang, Xuesong Leng, Jiuchun Yan, Weibing Guo, Yu Fu, Tianming Luan. Al 1060/Pure Iron Clad Materials by Vacuum Roll Bonding and Their Solderability [J]. J. Mater. Sci. Technol., 2013, 29(10): 948-954.
[8]	Haifei Zhou, Jingdong Guo, Qingsheng Zhu1, Jianku Shang. Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint [J]. J. Mater. Sci. Technol., 2013, 29(1): 7-12.
[9]	M.L. Huang, N. Kang, Q. Zhou, Y.Z. Huang. Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu Joints [J]. J. Mater. Sci. Technol., 2012, 28(9): 844-852.
[10]	Wei Zhang, Ying Zhong, Chunqing Wang. Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder [J]. J Mater Sci Technol, 2012, 28(7): 661-665.
[11]	Qingquan Lai, Lei Zhang, Cai Chen, J.K. Shang. Tunable Reactive Wetting of Sn on Microporous Cu Layer [J]. J Mater Sci Technol, 2012, 28(4): 379-384.
[12]	Niwat Mookam, Kannachai Kanlayasiri. Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging [J]. J Mater Sci Technol, 2012, 28(1): 53-59.
[13]	T.Y. Kang, Y.Y. Xiu, L. Hui, J.J. Wang, W.P. Tong, C.Z. Liu. Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect [J]. J Mater Sci Technol, 2011, 27(8): 741-745.
[14]	X.J. Wang Q.L. Zeng Q.S. Zhu Z.G. Wang J.K. Shang. Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints [J]. J Mater Sci Technol, 2010, 26(8): 737-742.
[15]	Hongchuan Jiang Chaojie Wang Wanli Zhang Xu Si Yanrong Li. Influences of Film Thickness on the Electrical Properties of TaN_x Thin Films Deposited by Reactive DC Magnetron Sputtering [J]. J Mater Sci Technol, 2010, 26(7): 597-600.

Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

RichHTML

PDF (PC)

Knowledge

Abstract

Cite this article

share this article

References

Related Articles 15

Recommended Articles

Metrics

Comments