Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint

doi:10.1016/j.jmst.2012.12.006

J. Mater. Sci. Technol. ›› 2013, Vol. 29 ›› Issue (1): 7-12.DOI: 10.1016/j.jmst.2012.12.006

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Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint

Haifei Zhou¹⁾, Jingdong Guo¹⁾, Qingsheng Zhu¹⁾, Jianku Shang^1,2)

1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA

Received:2012-04-10 Revised:2012-05-08 Online:2013-01-30 Published:2013-02-04
Contact: Jingdong Guo
Supported by:
National Basic Research Program of China (No. 2004CB619306), the National Natural Science Foundation of China (Nos. 51171191 and 51101161), and the Major National Science and Technology Program of China (No. 2011ZX02602).

Abstract

Abstract:

Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fee42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni²⁺and^Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fee42Ni(P) alloy may become an attractive under-bump metallization (UBM).

Key words: Under-bump metallization (UBM), Electroless FeL42Ni(P), Sn, Solderability, Interfacial reaction

Haifei Zhou, Jingdong Guo, Qingsheng Zhu1, Jianku Shang. Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint[J]. J. Mater. Sci. Technol., 2013, 29(1): 7-12.

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Application of Electroless FeL42Ni(P) Film for Under-bump Metallization on Solder Joint

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