Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

J Mater Sci Technol ›› 2010, Vol. 26 ›› Issue (2): 156-162.

• Regular Papers • Previous Articles Next Articles

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Qiulian Zeng^1,2), Jianjun Guo¹⁾, Xiaolong Gu¹⁾, Xinbing Zhao²⁾, Xiaogang Liu¹⁾

1) Zhejiang Province Key laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China
2) Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China

Received:2008-10-27 Revised:2009-01-15 Online:2010-02-28 Published:2010-02-28
Contact: Jianjun Guo
Supported by:
the Science and Technology Program of Zhejiang Province, China (No. 2008F1024)

Abstract

Abstract:

Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340{400°C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360°C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn /Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.

Key words: Wetting, Interfacial reaction, High temperature lead-free solder, Sn-10Sb-5Cu solder

Qiulian Zeng, Jianjun Guo, Xiaolong Gu, Xinbing Zhao, Xiaogang Liu. Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate[J]. J Mater Sci Technol, 2010, 26(2): 156-162.

References

[1 ] J.W. Jang, P.G. Kim, K.N. Tu and M. Lee: J. Mater.Res., 1999, 14(10), 3895.
[2 ] M.M. El-Bahay, M.E. El Mossalamy, M. Mahdy and A.A. Bahgat: Phys. Status Solidi A, 2003, 198(1), 76.
[3 ] K.L. Murty, M.D. Mathew and F.M. Haggag: Met. Mater. Int., 1998, 4, 799.
[4 ] R.K. Mahidhara, S.M.L. Sastry, K.L. Jerina, I.Turlik and K.L. Murty: J. Mater. Sci. Lett., 1994, 13(19), 1387.
[5 ] M.H.N. Beshai, S.K. Habib, A.M. Yassein, G. Saad and M.M.H. El-Naby: Cryst. Res. Technol., 1999, 34(1), 119.
[6 ] A. Yassin, R.L. Reuben, G. Saad, M.H.N. Beshai and S.K. Habib: Proc. IME J. Mater. Des. Appl., 1999, 213(L1), 59.
[7 ] K.L. Murty, F.M. Haggag and R.K. Mahidhara: J. Electron. Mater., 1997, 26(7), 839.
[8 ] A.R. Geranmayeh and R. Mahmudi: J. Electron. Mater., 2005, 34(7), 1002.
[9 ] R.K. Mahidhara, S.M.L. Sastry, I. Turlik and K.L. Murty: Scripta Mater., 1994, 31(9), 1145.
[10] M.D. Mathew, H. Yang, S. Movva and K.L. Murty: Metall. Mater. Trans. A, 2005, 36(1), 99.
[11] A.A. El-Daly, Y. Swilem and A.E. Hammad: J. Alloy. Compd., 2009, 471(1-2), 98.
[12] S.W. Chen, C.C. Chen, W. Gierlotka, A.R. Zi, P.Y. Chen and H.J. Wu: J. Electron. Mater., 2008, 37(7), 992.
[13] Q.L. Zeng, X.L. Gu, X.B. Zhao, C.Z. Chen and X.G. Liu: Electron. Compon. Mater., 2008, 27(8), 16. (in Chinese)
[14] C. Lee, C.Y. Lin and Y.W. Yen: Intermetallics, 2007, 15(8), 1027.
[15] P. Villars, A. Prince and H. Okamoto: Handbook of Ternary Alloy Phase Diagrams, 2nd edn, ASM International, The Materials Information Society, 1997, 10005.
[16] E.P. Lopez, P.T. Vianco and J.A. Rejent: J. Electron. Mater., 2005, 34(3), 299.
[17] P.T. Vianco and J.A. Rejent: J. Electron. Mater., 1999, 28(10), 1138.
[18] J.J. Guo, A.P. Xian and J.K. Shang: Surf. Coat. Technol., 2007, 202(2), 268.
[19] Q.L. Zeng, J.J. Guo, X.L. Gu, X.B. Zhao and X.G. Liu: Liquid-State Interfacial Reaction of Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate,
in Int. Conf. on Electronic Packaging Technology & High Density Packaging, July 2008, Shanghai, China.
[20] S.W. Chen, A.R. Zi, P.Y. Chen, H.J. Wu, Y.K. Chen and C.H. Wang: Mater. Chem. Phys., 2008, 111(1), 17.
[21] H.Q. Wang, X. Ma, F. Gao and Y.Y. Qian: Mater. Chem. Phys., 2006, 99(2-3), 202.
[22] B.J. Lee, N.M. Hwang and H.M. Lee: Acta Mater., 1997, 45(5), 1867.
[23] H.M. Lee, S.W. Yoon and B.J. Lee: J. Electron. Mater., 1998, 27(11), 1161.
[24] K.N. Tu and R.D. Thompson: Acta Metallugr., 1982, 30(5), 947.
[25] D. Grivas, D. Frear, L. Quan and J.W. Jr. Morris: J. Electron. Mater., 1986, 15(6), 355.
[26] K.H. Prakash and T. Sritharan: Acta Mater., 2001, 49(13), 2481.

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Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

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