(1) K.A.Jackson and H.J.Leamy:in Proc.AIP Conf.50 on Laser-Solid Interactions and Laser Processsing,1987,edited by S.D.Ferris,H.J.Leamy,and J.M.Poate,AlP,New York,1979,102. (2) K.A.Jackson,G.H.Gilmer and H.J.Leamy:Laser and Electron Beam Processing of Materials,Edited by C.W.White and P.S.Peercy;Academic,New York,1980,104. (3) J.W.Cahn,S.R.Coriell and W.J.Boettinger:Laser and Electron Beam Processing of Materials,edited by C.W.White and P.S.Peercy;Academic,New York,1980,89. (4) R.F.Wood:Phys.Rev.,1981,B25,2786. (5) M.J.Aziz:J.Appl.Phys.,1982,53,1158. (6) M.J.Aziz:Appl.Phys.Lett.,1983,43,552. (7) M.J.Aziz,J.Y.Tsao,M.O.Thompson,P.S.Peercy and C.W.White:Mater.Res.Soc.Proc.,1985,35,153. (8) M.J.Aziz and C.W.White:Phys.Rev.Lett.,1986,57,2675. (9) M.J.Aziz and T.Kaplan:Acta Metall.,1988,36,2335. (10) K.Y.Chen,Q.C.Li and J.Q.Guo:J.Appl.Phys.,1991,69,7325. (11) M.C.Flemings:Solidification Processing,McGraw-Hill Book Company,New York,1974,88. |