J. Mater. Sci. Technol. ›› 2021, Vol. 89: 107-113.DOI: 10.1016/j.jmst.2021.02.025

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Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications

Hong-Lei Chena,b, Xue-Mei Luoa,*(), Dong Wangc, Peter Schaafc, Guang-Ping Zhanga,*()   

  1. aShenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
    bSchool of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
    cInstitute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano®, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany
  • Received:2020-11-16 Revised:2021-01-07 Accepted:2021-02-07 Published:2021-10-30 Online:2021-10-30
  • Contact: Xue-Mei Luo,Guang-Ping Zhang
  • About author:gpzhang@imr.ac.cn(G.-P. Zhang).
    *E-mail addresses: xmluo@imr.ac.cn (X.-M. Luo),

Abstract:

The fatigue damage behavior of the nanocrystalline Au films on polyimide substrates was investigated. It was found that the very high-cycle fatigue damage resistance of the Au film was significantly enhanced by at least a factor of ∼2 in supported loading through adding an ultrathin Ti interlayer at the Au film/polyimide interface. Such a better fatigue damage resistance is mainly ascribed to the effective suppression of voiding at the Au film/polyimide interface through modulation of the Au/Ti interface, and thus the propensity of the cyclic strain localization and grain boundary cracking is reduced. The finding may provide a potential strategy for the design of flexible devices with ultra-long fatigue life.

Key words: Thin films, Ti interlayer, Fatigue, Extrusion, Interface