J Mater Sci Technol ›› 2012, Vol. 28 ›› Issue (6): 481-487.

• Nanomaterials and Nanotechnology •     Next Articles

Impurity Effect on Wear Resistance of Ultrafine-Grained Copper

Bin Yao, Zhong Han, Ke Lu   

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
  • Received:2012-03-20 Revised:2012-05-09 Online:2012-06-28 Published:2012-07-26
  • Contact: Zhong Han
  • Supported by:

    the MOST 973 Project (Grant No. 2012CB932201), International S&T Cooperation Project of China (Grant No. 2010DFB54010), the National Natural Science Foundation (No. 51141008), the CAS International Cooperation Project (Grant No. GJHZ1033) & the CAS-Croucher Funding Scheme for Joint Laboratories, and the Danish-Chinese Centre for Nanometals (Grant No. 50911130230)

Abstract: The wear properties of ultrafine-grained (UFG) Cu samples of different purities were investigated in comparison with the coarse-grained (CG) Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi-static compression, exhibit an enhanced wear resistance relative to the CG Cu samples. For both the UFG and the CG Cu samples, wear volumes increase at higher purities. A steady state worn subsurface structure was formed in each sample after sliding for 60 min, consisting of a heavily deformed nanostructured mixing layer (NML) on top of a continuous dynamic recrystallization (DRX) layer. A pronounced correlation is identified that wear volume increases monotonically with an increasing grain size of the DRX layer. The impurity level of the Cu samples has an obvious in°uence on the DRX grain sizes, which in turn determines the wear resistance of the Cu samples.

Key words: Ultrafine grained copper , Wear resistance , Impurity , Subsurface microstructure , Dynamic recrystallization