Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature

Abstract

Abstract: A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (<15°) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect Σ3 coincidence (60°/<111>) up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship.

Key words: Quantitative structural characterization, Cu, Dynamic plastic deformation, Transmission electron microscopy, Convergent beam electron diffraction

F. Yan, H.W. Zhang, N.R. Tao, K. Lu. Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature[J]. J Mater Sci Technol, 2011, 27(8): 673-679.

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