[1 ] H.T. Feng, R.F. Zhuo, J.T. Chen, D. Yan, J.J. Feng, H.J. Li, S. Cheng, Z.G. Wu, J. Wang and P.X. Yan: Nanoscale Res. Lett., 2009, 4, 1452.[2 ] Z.F. Liu, G. Bai, Y. Huang, F.F. Li, Y.F. Ma, T.Y. Guo, X.B. He, X. Lin, H.J. Gao and Y.S. Chen: J. Phys. Chem. C, 2007, 111, 13696.[3 ] N.J. Tang, W. Zhong, C. Au, Y. Yang, M.G. Han, K.J. Lin and Y.W. Du: J. Phys. Chem. C, 2008, 112, 19316.[4 ] W.L. Song, M.S. Cao, Z.L. Hou, X.Y. Fang, X.L. Shi and J. Yuan: Appl. Phys. Lett., 2009, 94, 233110.[5 ] W.L. Song, M.S. Cao, Z.L. Hou, J. Yuan and X.Y. Fang: Scripta Mater., 2009, 61, 201.[6 ] Y.Q. Kang, M.S. Cao, J. Yuan and X.L. Shi: Mater. Lett., 2009, 63, 1344.[7 ] M.S. Cao, W.L. Song, Z.L. Hou, B. Wen and J. Yuan: Carbon, 2010, 48, 788.[8 ] H.B. Jin, M.S. Cao, W. Zhou and S. Agathopoulos: Mater. Res. Bull., 2010, 45, 247.[9 ] H.P. Martin, R. Eeke and E. MÄuller: J. Eur. Ceram. Soc., 1998, 18, 1737.[10] S. Klein, M. Winterer and H. Hahn: Chem. Vapor Depos., 1998, 4, 143.[11] G.Z. Zou, M.S. Cao, H.B. Lin, H.B. Jin, Y.Q. Kang and Y.J. Chen: Powder Technol., 2006, 168, 84.[12] D.L. Zhao, F. Luo and W.C. Zhou: Adv. Mater. Res., 2005, 11-12, 141. [13] D.L. Zhao, H.S. Zhao and W.C. Zhou: Physica E, 2001, 9, 679.[14] B. Zhang, J.B. Li, J.J. Sun, S. Zhang, H. Zhai and Z. Du: J. Eur. Ceram. Soc., 2002, 22, 93.[15] H.S. Liu, X.Y. Fang, W.L. Song, Z.L. Hou, R. Lu, J. Yua and M.S. Cao: Chin. Phys. Lett., 2009, 26, 067101.[16] X.L. Su, W.C. Zhou, F. Luo, Z.M. Li and D.M. Zhu: J. Alloy. Compd., 2009, 476, 644.[17] Z.M. Li, F. Luo, X.L. Su, D.M. Zhu and W.C. Zhou: Trans. Nonferrous Met. Soc. China, 2007, 17, s656.[18] J.J. Moore and H.J. Feng: Prog. Mater. Sci., 1995, 39, 243.[19] J. Narayan, R. Raghunathan, R. Chowdhury and K. Jagannadham: J. Appl. Phys., 1994, 75, 7252.[20] X.L. Su, W.C. Zhou, Z.M. Li, F. Luo, H.L. Du and D.M. Zhu: Mater. Res. Bull., 2009, 44, 880.[21] E. Valcheva, M. Baleva and G. Zlateva: Mater. Sci. Eng. B, 2009, 165, 153.[22] Y. Qiu and L. Gao: J. Eur. Ceram. Soc., 2003, 23, 2015.[23] S.Y. Davydov: Phys. Solid State, 2004, 46, 235. |