J. Mater. Sci. Technol. ›› 2022, Vol. 130: 27-34.DOI: 10.1016/j.jmst.2022.05.008

• Research Article • Previous Articles     Next Articles

Dislocation reconfiguration during creep deformation of an Al-Cu-Li alloy via electropulsing

Chang Zhoua, Lihua Zhana,b,c,*(), He Lic, Chunhui Liua,c,*(), Yongqian Xuc, Bolin Mac, Youliang Yangc, Minghui Huangb,c   

  1. aCollege of Mechanical and Electrical Engineering, Central South University, Changsha, 410083, China
    bState Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, 410083, China
    cLight Alloys Research Institute, Central South University, Changsha, 410083, China
  • Received:2021-12-25 Revised:2022-05-04 Accepted:2022-05-04 Published:2022-12-10 Online:2022-12-07
  • Contact: Lihua Zhan,Chunhui Liu
  • About author:E-mail addresses: chunhuiliu@csu.edu.cn (C. Liu).
    ∗ E-mail addresses: yjs-cast@csu.edu.cn (L. Zhan),

Abstract:

Creep mechanism was well-known to be mainly dominated by the dislocation sliding and climbing during creep deformation. Here we study the creep deformation of an Al-Cu-Li alloy with the assistance of electropulsing and subsequent microstructural observations. We find that creep strain increased drastically under electropulsing and was almost twelve times as much as that of the non-pulsed sample. Microstructural observations confirmed that dislocation reconfiguration happens via electropulsing, namely helical dislocations being opened rapidly. This opened dislocation structure can possess a much higher mobility than the initial helical dislocation, which mostly responsible for the greatly increased creep strain. Our results revealed a new mechanism accountable for the distinctly electroplastic creep deformation.

Key words: Dislocation reconfiguration, Electroplasticity, Al-Cu-Li alloy, Creep deformation