Properties and precipitates of the high strength and electrical conductivity Cu-Ni-Co-Si-Cr alloy

doi:10.1016/j.jmst.2021.03.049

Abstract

Abstract:

In this paper, a novel Cu-1.5Ni-1.1Co-0.6Si-0.1Cr (wt.%) alloy with high strength and electrical conductivity was designed. After aging, excellent properties of 857±12 MPa yield strength, 300±8 HV microhardness, 42.8 ± 2.5% IACS conductivity, and 7 ± 0.5% elongation were obtained. According to the atomic structure, part of Ni atoms in Ni₂Si can be replaced by Co atoms to form nano-precipitates (Ni, Co)₂Si. The alloy's high strength and conductivity are mainly attributed to the fine and uniformly distributed (Ni, Co)₂Si and Cr nano precipitates. The alloy strength was also enhanced by twins, dislocations, and grain refining strengthening. Based on the investigations of deformation microstructure and the orientation relationship between the (Ni, Co)₂Si precipitates and the Cu matrix, the main reason for elongation increase is attributed to the formation of deformation twins and the small lattice mismatch strain at the coherent interfaces of precipitates and the Cu matrix.

Key words: Copper, Mechanical properties, Precipitates, Deformation twins

Yijie Ban, Yongfeng Geng, Jinrui Hou, Yi Zhang, Meng Zhou, Yanlin Jia, Baohong Tian, Yong Liu, Xu Li, Alex A. Volinsky. Properties and precipitates of the high strength and electrical conductivity Cu-Ni-Co-Si-Cr alloy[J]. J. Mater. Sci. Technol., 2021, 93: 1-6.

Figures/Tables 5

Fig. 1. (a) Variation of hardness with aging time for the Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy aged at 500 °C; (b) Tensile strength and conductivity of this work and various types of alloys [24], [25], [26].

Fig. 2. Microstructures of the Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy aging at 500 °C for 1 h. (a) Bright-field TEM images of the alloy; (b) beam direction of SADP along [001]Cu; (c) EDS spectra of the δ-(Ni, Co)2Si in (d); (d)?(h) BF TEM image, and EDS maps of the (Ni, Co)2Si, respectively.

Fig. 3. HRTEM images and corresponding FFT patterns of the Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy aged at 500 °C for 1 h: (a) crystal structure of (Ni, Co)2Si; (b) bright-field TEM image; (c) dark-field TEM image; (d) nanoscale stacking faults; (e) HRTEM image taken from [110]Cu, (f) FFT pattern of (Ni, Co)2Si in (e); (g) FFT pattern of Cu matrix in (e); (h) HRTEM image of Cu matrix and (Ni, Co)2Si boundary; (i) inversed FFT images of i region in (e); (j?l) bright-field images and SADP of Cr.

Fig. 4. (a) Stress-strain curves of the Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy and Cu-Ni-Si-(x) alloys designed based on aging; (b) bright-field TEM images; (c) HRTEM image of TB layers; (d) and (e) FFT pattern of twins and Cu matrix; (f) EBSD image of Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy aged at 500 °C for 1 h; (g) KAM map; (h) twin boundaries (TB) maps, where the blue lines are the twin boundaries.

Fig. 5. (a) Strength and (b) electrical resistivity distribution histograms of the Cu-1.5Ni-1.1Co-0.6Si-0.1Cr alloy.

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