J Mater Sci Technol ›› 2009, Vol. 25 ›› Issue (01): 77-80.

• Letters • Previous Articles     Next Articles

Residual Strains in a Nanometer Thick Cr Film Measured on Micromachined Beams

 Z.M. Zhou,  Yong Zhou,  Ying Cao and Haiping Mao   

  1. Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Mi-
    cro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200030, China
  • Received:2007-07-09 Revised:2007-09-27 Online:2009-01-28 Published:2009-10-10

Abstract:

A Cr film with a 75 nm thickness sputtered on a Si substrate was used to fabricate microbridge and microcan- tilever samples with the MEMS (microelectromechanical system) technique. The profile of the buckled beams was measured by using the interference technique with white light and fitted with a theoretical result. The uniform residual strain in the bridge samples was deduced from the variation of buckling amplitude with the beam length. On the other hand, the gradient residual strain was determined from the deflection profile of the cantilever. The residual uniform and gradient strain in the Cr film are about 4.96×10-3 and 4.2967×10-5, respectively.

Key words: Residual Strain, Microelectromechanical system (MEMS), Microbridge, Microcantilever