J. Mater. Sci. Technol. ›› 2025, Vol. 214: 11-15.DOI: 10.1016/j.jmst.2024.06.032

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High ductility induced by twin-assisted grain rotation and merging in solid-state cold spray additive manufactured Cu

Wenya Lia,b,*, Jingwen Yanga,b, Zhengmao Zhanga,b, Yingchun Xiec, Chunjie Huanga,b,*   

  1. aState Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, PR China;
    bShaanxi Key Laboratory of Friction Welding Technologies, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, PR China;
    cInstitute of New Materials, Guangdong Academy of Sciences, National Engineering Laboratory of Modern Materials Surface Engineering Technology, Guangdong Provincial Key Laboratory of Modern Surface Engineering Technology, Guangzhou 510651, PR China
  • Received:2024-05-06 Revised:2024-06-21 Accepted:2024-06-24 Published:2025-04-10 Online:2025-04-05
  • Contact: *E-mail addresses: liwy@nwpu.edu.cn (W. Li), huangc@nwpu.edu.cn (C. Huang)

Abstract: In contrast to fusion-based additive manufacturing (AM) methods, cold spray (CS) is a solid-state metal powder deposition process that has evolved from a traditional coating method to a novel AM technique, i.e. CSAM, for fabricating components and repairing damaged parts. In this study, we demonstrate that the long-standing low ductility of CSAM metallic deposits can be addressed through constructing a unique microstructure. A Cu deposit with 29.7% in elongation and 270 MPa in tensile strength has been produced using a proper spray parameter set. The high ductility of the Cu deposit originates from grain rotation and merging during tensile deformation, which is facilitated by twin boundaries acting as a bridge to dislocations slip. The understanding of high-ductility Cu deposits may help develop other high-strength and high-ductility CSAM metallic materials.

Key words: Cold spray additive manufacturing, Copper, High ductility, Twin, Grain growth