Hierarchical porous SiCnws/SiC composites with one-dimensional oriented assemblies for high-temperature broadband wave absorption

doi:10.1016/j.jmst.2024.05.076

Abstract

Abstract: The research on high-performance electromagnetic wave absorption materials with high-temperature and oxidative stability in extreme environments is gaining popularity. Herein, the lightweight silicon carbide nanowires (SiC_nws)/SiC composites are fabricated with in-situ SiC interface on one-dimensional oriented SiC_nws skeleton, which collaborative configuration by 3D printing and freeze casting assembly. The constructed porous structure optimizes the impedance matching degree and scattering intensity, the maximum effective absorption bandwidth (EAB_max) of 5.9 GHz and the minimum reflection loss (RL_min) of -41.4 dB can be realized. Considering the inherent oxidation resistance of SiC, the composites present well-maintained absorption performance at 600 °C. Even at 1100 °C, the EAB_max of 4.9 GHz and RL_min of -30.4 dB also demonstrate the high-temperature absorption stability of the composites, indicating exceptional wave absorption properties and thermal stability. The slight attenuation can be attributed to the decrease in impedance matching capability accompanying the elevated dielectric constant. This work clarifies the impact of structure and component synergy on wave absorption behavior, and offers a novel approach to producing high-performance and high-temperature resistance ceramic-based electromagnetic wave absorption materials suitable for extreme environments.

Key words: Electromagnetic wave absorption, Porous structure, Interface, SiC_nws/SiC composites, High-temperature resistance

Huiying Ouyang, Xiao You, Yuanhang Yang, Meihan Ren, Qiuqi Zhang, Ruixiang Deng, Xiangyu Zhang, Jinshan Yang, Shaoming Dong. Hierarchical porous SiC_nws/SiC composites with one-dimensional oriented assemblies for high-temperature broadband wave absorption[J]. J. Mater. Sci. Technol., 2025, 214: 1-10.

References

[1] Z. Wu, H.-W. Cheng, C.Jin, B. Yang, C. Xu, K. Pei, H. Zhang, Z. Yang, R. Che, Adv. Mater. 34(2022) 2107538.
[2] J. Ma, W. Li, Y. Fan, J. Yang, Q. Yang, J. Wang, W. Luo, W. Zhou, N. Nomura, L. Wang, W. Jiang, ACS Appl. Mater. Interfaces 11 (2019) 46386-46396.
[3] F. Shahzad, M. Alhabeb, C.B. Hatter, B. Anasori, S. Man Hong, C.M. Koo, Y. Gogotsi, Science 353 (2016) 1137-1140.
[4] X. Zhong, M. He, C. Zhang, Y. Guo, J. Hu, J. Gu, Adv. Funct. Mater. 34(2024) 2313544.
[5] J. Xiao, X. Qi, L. Wang, T. Jing, J.-L. Yang, X.Gong, Y. Chen, Y. Qu, Q. Peng, W. Zhong, Nano Res. 16(2023) 5756-5766.
[6] H. Chen, Z. Huang, Y. Huang, Y. Zhang, Z. Ge, W. Ma, T. Zhang, M. Wu, S. Xu, F. Fan, S. Chang, Y. Chen, ACS Appl. Mater. Interfaces 11 (2019) 1274-1282.
[7] X. You, J. Yang, K. Huang, M. Wang, X. Zhang, S. Dong, Carbon 155 (2019) 215-222.
[8] G. Dai, X. You, R. Deng, T. Zhang, H. Ouyang, L. Song, Adv. Funct. Mater. 34(2023) 2308710.
[9] J. Xiao, B. Zhan, X. Qi, J. Ding, Y. Qu, X. Gong, J.-L. Yang, L. Wang, W. Zhong, R. Che, Small (2024), doi: 10.1002/smll.202311312.
[10] J. Xiao, B. Zhan, M. He, X. Qi, X. Gong, J.-L. Yang, Y.Qu, J. Ding, W. Zhong, J. Gu, Adv. Funct. Mater. 34(2024) 2316722.
[11] M. He, J. Hu, H. Yan, X. Zhong, Y. Zhang, P. Liu, J. Kong, J. Gu, Adv. Funct. Mater. 34(2024) 2316691.
[12] B. Zhan, Y. Hao, X. Qi, Y. Qu, J. Ding, J. Yang, X. Gong, Y. Chen, Q. Peng, W. Zhong, Nano Res. 17(2024) 927-938.
[13] X. You, G. Dai, R. Deng, T. Zhang, L. Song, X. Zhang, Y. Ding, J. Yang, S. Dong, Addit. Manuf. 55(2022) 102855.
[14] Q. Zhang, X. You, L. Tian, M. Wang, X. Zhang, Y. Shi, J. Yang, S. Dong, J. Mater. Sci.Technol. 155(2023) 192-201.
[15] M. Qin, L. Zhang, X. Zhao, H. Wu, Adv. Funct. Mater. 31(2021) 2103436.
[16] D. Li, D. Jia, Z. Yang, Y. Zhou, Int. Mater. Rev. 67(2022) 266-297.
[17] A. Iqbal, F. Shahzad, K. Hantanasirisakul, M.-K. Kim, J. Kwon, J. Hong, H. Kim, D. Kim, Y. Gogotsi, C.M. Koo, Science 369 (2020) 446-450.
[18] C.A.F.Nason, A.P. Vijaya Kumar Saroja, Y.Lu, R. Wei, Y. Han, Y. Xu, Nano-Micro Lett. 16(2023) 1.
[19] L. Xiang, A.K. Darboe, Z. Luo, X. Qi, J. Shao, X.-J. Ye, C.-S. Liu, K. Sun, Y. Qu, J. Xu, W. Zhong, Adv. Compos. Hybrid Mater. 6(2023) 215.
[20] S. Zhang, D. Lan, J. Zheng, J. Kong, J. Gu, A. Feng, Z. Jia, G. Wu, Carbon 221 (2024) 118925.
[21] X. Dai, Y. Du, J. Yang, D. Wang, J. Gu, Y. Li, S. Wang, B.B. Xu, J. Kong, Compos. Sci. Technol. 174(2019) 27-32.
[22] Y. Zhang, Y. Liu, L. Cao, H. Fang, B. Liu, Y. Cao, J. Wang, J. Chen, Y. Pan, Ceram. Int. 47(2021) 34333-34340.
[23] Y. Tian, M. Huang, N. Kong, Z. Wang, C. Ye, L. Fu, K. Jia, J. Fan, R. Tan, F. Han, Carbon 214 (2023) 118352.
[24] D. Pan, G. Yang, H.M.Abo-Dief, J.Dong, F. Su, C. Liu, Y. Li, B. Bin Xu, V. Murugadoss, N. Naik, S.M. El-Bahy, Z.M. El-Bahy, M. Huang, Z. Guo, Nano-Micro Lett. 14(2022) 118.
[25] B. Hao, Z. Tao, X. Yan, W. Liu, Y. Luo, Z. Liu, D. Jiang, Carbon 196 (2022) 540-551.
[26] T. Gao, H. Rong, K.H. Mahmoud, J. Ruan, S.M.El-Bahy, A.A. Faheim, Y. Li, M. Huang, M.A. Nassan, R. Zhao, Adv. Compos. Hybrid Mater. 5(2022) 1158-1167.
[27] X. Lv, F. Ye, L. Cheng, L. Zhang, J. Mater. Sci.Technol. 109(2022) 94-104.
[28] H.-Y. Wang, X.-B. Sun, Y. Xin, S.-H. Yang, P.-F. Hu, G.-S. Wang, J. Mater. Sci. Technol. 134(2023) 132-141.
[29] S.C. Barros, A.A. da Silva, D.B. Costa, C.M. Costa, S. Lanceros-Mendez, M.N.T. Maciavello, J.L.G. Ribelles, F. Sentanin, A. Pawlicka, M.M. Silva, Cellulose 22 (2015) 1911-1929.
[30] Q. Wang, Y. He, M. Shen, L. Huang, L. Ding, J. Hu, Y. Dong, H. Fu, Q. Wang, Y. Sun, L. Zhang, J. Cao, Y. Duan, Adv. Funct. Mater. 31(2021) 2011170.
[31] B.P. Heller, D.E. Smith, D.A. Jack, Addit. Manuf. 12(2016) 252-264.
[32] M. Trebbin, D. Steinhauser, J. Perlich, A. Buffet, S.V. Roth, W. Zimmermann, J. Thiele, S. Forster, Proc. Natl. Acad. Sci 110 (2013) 6706-6711.
[33] J. Bai, S. Huang, X. Yao, X. Liu, Z. Huang, J. Mater. Chem. A 11 (2023) 6274-6285.
[34] R. Deng, B. Chen, H. Li, Z. Li, T. Zhang, Y. Yu, L. Song, Appl. Surf. Sci. 569(2021) 151053.
[35] H. Pang, W. Pang, B. Zhang, N. Ren, J. Mater. Chem. C 6 (2018) 11722- 11730.
[36] B. Wang, J. Wei, Y. Yang, T. Wang, F. Li, J. Magn. Magn.Mater. 323(2011) 1101-1103.
[37] F. Pan, M. Ning, Z. Li, D. Batalu, H. Guo, X. Wang, H. Wu, W. Lu, Adv. Funct. Mater. 33(2023) 2300374.
[38] Y. Lu, Y. Wang, H. Li, Y. Lin, Z. Jiang, Z. Xie, Q. Kuang, L. Zheng, ACS Appl. Mater. Interfaces 7 (2015) 13604-13611.
[39] X. Qiu, L. Wang, H. Zhu, Y. Guan, Q. Zhang, Nanoscale 9 (2017) 7408- 7418.
[40] C. Wu, J. Wang, X. Zhang, L. Kang, X. Cao, Y. Zhang, Y. Niu, Y. Yu, H. Fu, Z. Shen, K. Wu, Z. Yong, J. Zou, B. Wang, Z. Chen, Z. Yang, Q. Li, Nano-Micro Lett. 15(2022) 7.
[41] T. Li, J. Li, Z. Xu, Y. Tian, J. Li, J. Du, F. Meng, Small 19 (2023) 2300233.
[42] Y. Wang, X. Han, P. Xu, D. Liu, L. Cui, H. Zhao, Y. Du, Chem. Eng. J. 372(2019) 312-320.
[43] G. Dai, R. Deng, T. Zhang, Y. Yu, L. Song, Adv. Funct. Mater. 32(2022) 2205325.
[44] T. Jia, Y. Hao, X. Qi, Y. Rao, L. Wang, J. Ding, Y. Qu, W. Zhong, J. Mater. Sci.Technol. 176(2024) 1-12.
[45] Q. Zhou, X. Yin, F. Ye, Z. Tang, R. Mo, L. Cheng, Ceram. Int. 45(2019) 6514-6522.
[46] W. Duan, X. Yin, Q. Li, X. Liu, L. Cheng, L. Zhang, J. Eur. Ceram.Soc. 34(2014) 257-266.
[47] C. Chen, S. Zeng, X. Han, Y. Tan, W. Feng, H. Shen, S. Peng, H. Zhang, J. Mater. Sci.Technol. 54(2020) 223-229.
[48] X. Lan, Y. Li, Z. Wang, Chem. Eng. J. 397(2020) 125250.
[49] T. Han, R. Luo, G. Cui, L. Wang, J. Eur. Ceram.Soc. 39(2019) 1743-1756.
[50] J. Xiao, X. Qi, X. Gong, Q. Peng, Y. Chen, R. Xie, W. Zhong, J. Mater. Sci.Technol. 139(2023) 137-146.
[51] Q. Liang, L. Wang, X. Qi, Q. Peng, X. Gong, Y. Chen, R. Xie, W. Zhong, J. Materi. Sci.Technol. 147(2023) 37-46.

Hierarchical porous SiC_nws/SiC composites with one-dimensional oriented assemblies for high-temperature broadband wave absorption

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