Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

J. Mater. Sci. Technol.

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Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

H.M. Hdz-García¹⁾, A.I. Martinez²⁾, R. Muñoz-Arroyo¹⁾, J.L. Acevedo-Dávila¹⁾, F. García-Vázquez¹⁾,F.A. Reyes-Valdes¹⁾

1) Corporación Mexicana de Investigación en Materiales S.A. de C.V., Ciencia y Tecnología No. 790, Fracc. Saltillo 400; Saltillo,Coah. CP. 25290, Mexico
2) Centro de Investigación y de Estudios Avanzados del IPN, Carr. Mty-Saltillo km. 13, Ramos Arizpe, Coah. CP. 25900, Mexico

Received:2013-01-19 Revised:2013-03-20 Online:2014-03-15 Published:2014-03-17
Contact: H.M. Hdz-García, A.I. Martinez
Supported by:
This work was supported by the National Council of Science and Technology (CONACYT).

Abstract

Abstract:

Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.

Key words: Brazing, Nanoparticles, Silicon, Stainless steel

H.M. Hdz-García, A.I. Martinez, R. Mu?oz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez,F.A. Reyes-Valdes. Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel[J]. J. Mater. Sci. Technol..

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Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

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