J Mater Sci Technol ›› 2012, Vol. 28 ›› Issue (4): 379-384.

• Regular Papers • Previous Articles    

Tunable Reactive Wetting of Sn on Microporous Cu Layer

Qingquan Lai, Lei Zhang, Cai Chen, J.K. Shang   

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
  • Received:2011-04-08 Revised:2011-05-09 Online:2012-04-30 Published:2012-04-24
  • Contact: Zhang Lei
  • Supported by:

    the National Natural Science Foundation of China (Grant No. 50501022) and the National Basic Research Program of China (Grant No. 2010CB631006).

Abstract: Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.

Key words: Wetting, Porous material, Soldering