J. Mater. Sci. Technol. ›› 2024, Vol. 192: 65-81.DOI: 10.1016/j.jmst.2023.11.078

• Research Article • Previous Articles     Next Articles

High impact toughness of CT20 alloy induced by multi-factor coupling

Runqi Zhanga, Qinyang Zhaob,*, Dizi Guoc,*, Yang Yingc, Huan Wangc, Zhongli Qiaoc, Yunbo Zhangc, Lin Wangd, Yongqing Zhaoa,c,*   

  1. aSchool of Materials Science and Engineering, Northeastern University, Shenyang 110819, China;
    bSchool of Material Science and Engineering, Chang'an University, Xi'an 710064, China;
    cNorthwest Institute for Nonferrous Metal Research, Xi'an 710016, China;
    dNational Key Laboratory of Science and Technology on Materials Under Shock and Impact, School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China
  • Received:2023-09-21 Revised:2023-11-25 Accepted:2023-11-27 Published:2024-09-01 Online:2024-02-05
  • Contact: * E-mail addresses: zqy@chd.edu.cn (Q. Zhao), gd17036@163.com (D. Guo), trc@cnin.com (Y. Zhao).

Abstract: Impact deformation behaviors of CT20 alloy with lamellar microstructure (LM), equiaxed microstructure (EM) and bimodal microstructure (BM) at room temperature were systematically investigated in this study. The experimental results indicated the excellent mechanical properties of CT20 alloy with BM under dynamic load. The impact toughness of BM specimen (∼118 J/cm2) is ∼17.5 % higher than that of LM specimen and ∼33.8 % higher than that of EM specimen. The impact energy of EM specimen is the lowest due to the relatively simple equiaxed microstructure. LM specimen can absorb the highest crack initiation energy due to the best twinning ability. The highest impact toughness of BM specimen is induced by multi-factor coupling during impact deformation. Finer initial equivalent grain size, smaller lamellar thickness, lamellar induces twinning, finer twins, crack propagation path, and interaction between twins and β lamellar are all factors affecting impact toughness.

Key words: CT20 alloy, Impact toughness, Deformation twinning, Dislocation mobility, Crack propagation