J. Mater. Sci. Technol. ›› 2015, Vol. 31 ›› Issue (5): 484-488.DOI: 10.1016/j.jmst.2014.12.007

• Orginal Article • Previous Articles     Next Articles

Structural Characterization of Laser Bonded Sapphire Wafers Using a Titanium Absorber Thin Film

A. de Pablos-Martín*, S. Tismer, Th. Höche   

  1. Fraunhofer Institute for Mechanics of Materials IWM, Walter-Hülse-Str. 1, 06120 Halle, Germany
  • Received:2014-10-23 Online:2015-05-20 Published:2015-07-23
  • Contact: Corresponding author. Ph.D.; Tel.: +49 345 5589 227; Fax: +49 345 5589 101. E-mail address: araceli.pablos-martin@iwmh.fraunhofer.de (A. de Pablos-Martín).
  • Supported by:
    The authors acknowledge financial support of FhG Internal Programs (Grant No. 692 280). The authors are very grateful to Nico Teuscher (Fraunhofer Institute for Mechanics of Materials IWM, Halle, Germany) for the Titanium sputtering on the sapphire substrates.

Abstract: Two sapphire substrates were tightly bonded by irradiation with a 1064 nm nanosecond laser and using a sputtered 50 nm-titanium thin film as an absorbing medium. Upon laser irradiation, aluminum from the upper substrate is incorporated into the thin film, forming Ti-Al-O compounds. While the irradiated region becomes transparent, the bond quality was evaluated by scanning acoustic microscopy.

Key words: Laser welding, Absorbing film, Sapphire wafer bonding