Effect of Solidification Rate on Microstructure and Solid/Liquid Interface Morphology of Ni-11.5 wt% Si Eutectic Alloy

doi:10.1016/j.jmst.2013.09.025

J. Mater. Sci. Technol. ›› 2015, Vol. 31 ›› Issue (3): 280-284.DOI: 10.1016/j.jmst.2013.09.025

• Orginal Article • Previous Articles Next Articles

Effect of Solidification Rate on Microstructure and Solid/Liquid Interface Morphology of Ni-11.5 wt% Si Eutectic Alloy

Chunjuan Cui^{1, *}, Jun Zhang², Tian Xue¹, Lin Liu², Hengzhi Fu²

1 School of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, China; 2 State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China

Received:2013-08-20 Online:2015-03-20 Published:2015-07-23
Contact: Corresponding author. Assoc. Prof., Ph.D.; Tel.: +86 29 822050104; Fax: +86 29 82202923. E-mail address: cuichunjuan@xauat.edu.cn (C. Cui).
Supported by:
The authors would like to thank the National Natural Science Foundation of China (No. 51201121), the Specialized Research Fund for the Doctoral Program of Higher Education (No. 20096120120017), the Fund of the State Key Laboratory of Solidification Processing in NWPU (No. SKLSP200904), the Natural Science Foundation of Shaanxi Province of China (No. 2012JQ6004), and the Specialized Research Fund of Education Commission of Shaanxi Province of China (No. 12JK0425) for financial support.

Abstract

Abstract: In this study Ni-Ni₃Si eutectic in situ composites are obtained by Bridgman directional solidification technique when the solidification rate varies from 6.0 μm/s to 40.0 μm/s. At the low solidification rates the lamellar spacing is decreased with increasing the solidification rate. When the solidification rate is higher than 25 μm/s, the lamellar spacing tends to be increased, because the higher undercooling makes the mass transport less effective. The adjustments of lamellar spacing are also observed during the directional solidification process, which is consistent with the minimum undercooling criterion. Moreover, the transitions from planar interface to cellular, then to dendritic interface, and finally to cellular interface morphologies with increasing velocity are observed by sudden quenching when the crystal growth tends to be stable.

Key words: Directional solidification, Eutectic in situ composite, Lamellar spacing, Solid/liquid interface

Chunjuan Cui, Jun Zhang, Tian Xue, Lin Liu, Hengzhi Fu. Effect of Solidification Rate on Microstructure and Solid/Liquid Interface Morphology of Ni-11.5 wt% Si Eutectic Alloy[J]. J. Mater. Sci. Technol., 2015, 31(3): 280-284.

Figures/Tables 5

References

[1] S. Oukassi, J.S. Moulet, S. Lay, F. Hodaj, Microelectron. Eng. 86 (2009) 397-403.
[2] H.M. Wang, C.M. Wang, L.X. Cai, Surf. Coat. Technol. 168 (2003) 202-208.
[3] H. Amekura, H. Kitazawa, N. Umeda, N. Kishimoto, Nucl. Instrum. MethodsPhys. Res. Sect. B 222 (2004) 114-122.
[4] J.H. Jia, J.J. Lu, H.D. Zhou, J.M. Chen, Mater. Sci. Eng. A 381 (2004) 80-85.
[5] R. Caram, S. Milenkovic, J. Cryst. Growth 198/199 (1999) 844-849.
[6] A.T. Dutra, P.L. Ferrandini, R. Caram, J. Alloy. Compd. 432 (2007) 167-171.
[7] D.M. Dimiduk, M.G. Mendiratta, P.R. Subramaniam, Structural Intermetallics,TMS, Warrendale, 1993, pp. 619-621.
[8] T. Takasugi, M. Yoshida, J. Mater. Sci. 36 (2001) 643-651.
[9] T. Takasugi, H. Kawai, Y. Kaneno, Mater. Sci. Eng. A 329e331 (2002) 446-454.
[10] K. Yasuyubi, W. Masamune, I. Hirofum, T. Takayuki, in: Autumn Meetings of the Japan Institute of Metals, Nagoya, Japan, 2002.
[11] C.J. Cui, J. Zhang, K. Wu, Y.P. Ma, L. Liu, H.Z. Fu, Physica B: Condensed Matter 407 (2012) 3566-3569.
[12] C.J. Cui, J. Zhang, K. Wu, D.N. Zou, Y.P. Ma, L. Liu, H.Z. Fu, Physica B: Condensed Matter 412 (2013) 70-73.
[13] R. Elliott, Eutectic Solidification Processing, Butterworths & Co, London, 1983.
[14] M.N. Croker, R.S. Fidler, R.W. Smith, Proc. R. Soc. London Ser. A 335 (1973) 15-37.
[15] Y.K. Rao, Stoichiometry and Thermodynamics of Metallurgical Processes,Cambridge Univ. Press, London, 1985, pp. 454-456.
[16] M.K. Datta, S.K. Pabi, B.S. Murty, J. Appl. Phys. 87 (2000) 8393-8400.
[17] F.W. Dynys, A. Sayir, J. Eur. Ceram. Soc. 25 (2005) 1293-1299.
[18] A.F. da Silveira, W.B. de Castro, B.A. Luciano, C.S. Kiminami, Mater. Sci. Eng. A 375e377 (2004) 473-478.
[19] S. Milenkovic, R. Caram, J. Cryst. Growth 237e239 (2002) 95-100.
[20] J.J. Yu, J. Zhang, F. Wang, J.S. Li, H.Z. Fu, Mater. Sci. Eng. A 311 (2001) 200-204.
[21] E.C. Adırlı, H. Kaya, M. Gündüz, J. Alloy. Compd. 431 (2007) 171-179.
[22] F. Sommer, R.N. Singh, E.J. Mittemeijer, J. Alloy. Compd. 467 (2009) 142-153.
[23] H.Q. Hu, The Principle of Metal Solidification, China Machine Press, Beijing,2000, pp. 172-174 (in Chinese).
[24] K.A. Jackson, J.D. Hunt, Trans. Metal. Soc. AIME 236 (1966) 1129-1142.

Effect of Solidification Rate on Microstructure and Solid/Liquid Interface Morphology of Ni-11.5 wt% Si Eutectic Alloy

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