Building metallurgical bonding interfaces in an immiscible Mo/Cu system by irradiation damage alloying (IDA)

doi:10.1016/j.jmst.2017.10.009

Abstract

Abstract:

For the immiscible Mo/Cu system with a positive heat of mixing (ΔH_m > 0), building metallurgical bonding interfaces directly between immiscible Mo and Cu and preparing Mo/Cu laminar metal matrix composites (LMMCs) are very difficult. To solve the problem, a new alloying method for immiscible systems, which is named as irradiation damage alloying (IDA), is presented in this paper. The IDA primarily consists of three steps. Firstly, Mo is damaged by irradiation with multi-energy (186, 62 keV) Cu ion beams at a dose of 2 × 10¹⁷ ions/cm². Secondly, Cu layers are superimposed on the surfaces of the irradiation-damaged Mo to obtain Mo/Cu laminated specimens. Thirdly, the irradiation damage induces the diffusion alloying between Mo and Cu when the laminated specimens are annealed at 950 ^°C in a protective atmosphere. Through IDA, Mo/Cu LMMCs are prepared in this paper. The tensile tests carried out for the Mo/Cu LMMCs specimens show that the Mo/Cu interfaces constructed via IDA have high normal and shear strengths. Additionally, the microstructure of the Mo/Cu interface is characterized by High Resolution Transmission Electron Microscopy (HRTEM), X-ray diffraction (XRD) and Energy Dispersive X-ray (EDX) attached in HRTEM. The microscopic characterization results show that the expectant diffusion between Mo and Cu occurs through the irradiation damage during the process of IDA. Thus a Mo/Cu metallurgical bonding interface successfully forms. Moreover, the microscopic test results show that the Mo/Cu metallurgical interface is mainly constituted of crystalline phases with twisted and tangled lattices, and amorphous phase is not observed. Finally, based on the positron annihilation spectroscopy (PAS) and HRTEM results, the diffusion mechanism of IDA is discussed and determined to be vacancy assisted diffusion.

Key words: Mo/Cu immiscible system, Irradiation damage alloying, Metallurgical bonding interface, Ion implantation, Laminar metal matrix composites

Jinlong Du, Yuan Huang, Chan Xiao, Yongchang Liu. Building metallurgical bonding interfaces in an immiscible Mo/Cu system by irradiation damage alloying (IDA)[J]. J. Mater. Sci. Technol., 2018, 34(4): 689-694.

Figures/Tables 12

Fig. 1. Schematic chart of the IDA for Mo/Cu LMMCs.

Fig. 2. Schematic diagram of fixtures for the Mo/Cu specimens: (a) fixture for the bar specimen, (b) fixture for the plate specimen. 1-molybdenum plate; 2-quartz plate; 3-damaged surface of Mo; 4-bolt; 5-nut; 6-pressure transducer.

Fig. 3. Tensile specimen for interfacial normal strength test: (a) structure schematic drawing of the bar specimen, (b) digital photo of the bar specimen.

Fig. 4. Tensile specimen for the shear strength test: (a) dumbbell-shaped plate specimen of Mo/Cu LMMCs, (b) section structure of the dumbbell-shaped specimen.

Fig. 5. Fracture metallographic images of the bar specimens of the Mo/Cu LMMCs: (a) specimen 1; (b) specimen 2; (c) specimen 3.

Table 1 Test results of interfacial normal strength obtained on the Mo/Cu bar specimens.

Specimen	Maximum tensile load	Effective area	Interfacial normal strength
	F (N)	A (mm²)	δ (MPa)
1	945.5	3.56	217.36
2	642.0	3.24	198.15
3	1026.2	4.66	220.20

Fig. 6. Tensile curve of the dumbbell-shaped plate specimen of Mo/Cu LMMCs.

Fig. 7. SEM images of the tensile fractured surface (a) and cross-section (b) of the fractured plate specimen of Mo/Cu LMMCs, and the EDS results (c) of the region marked with a red frame in (a).

Fig. 8. EDX line-scanning results of the Mo/Cu interface: (a) Drift-corrected spectrum image scanning; (b) EDX line-scanning profile along the red line in Fig. 8(a).

Fig. 9. XRD pattern of the as-constructed interface of the Mo/Cu LMMCs prepared by IDA, where the specimen is annealed at 950 °C in hydrogen for 8 h.

Fig. 10. (a) High-Resolution structure image of the Mo/Cu interface and (b) Enlarged image of the area marked with a white frame denoted by A in Fig. 10(a).

Fig. 11. Curves of S parameter vs mean positron implantation depth for the pure Mo and the Cu ion implantation irradiation damaged Mo. The results are obtained by PAS.

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