J Mater Sci Technol ›› 1998, Vol. 14 ›› Issue (1): 89-91.

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High Strength Conductor by Directional Solidification

Hongquan WEN; Xiemin MAO and Kuangdi XU (Institute of Materials Science and Technology, Shanghai University Shanghai 200072, China)   

  • Received:1998-01-28 Revised:1998-01-28 Online:1998-01-28 Published:2009-10-10

Abstract: The directional solidification of Cu-0.8 wt pct Cr alloy was investigated for high-strength conductors. An in-situ composite material in which the matrix is in cellular morphology and the well-distributed eutectics around the cells is formed in the directional solidification process. In such microstructure, the cellular matrix is as conductor and the coated-around eutectics as reinforcement. The formation mechanism of this microstructure is discussed from the interfacial instability. As a result, the tensile strength of the material along the solidification direction is two times more than that of the conventionally cast one, while the electrical conductivity is reduced a little by comparison with the pure Cu.