J Mater Sci Technol ›› 1996, Vol. 12 ›› Issue (3): 219-222.

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Wettability of CuNi-Ti Alloys on Si_3N_4 and Interfacial Reaction Products

Chuangeng WAN; Huaping XIONG and Zhenfeng ZHOU (Dept. of Materials Science and Engineering, Jilin University of Technology, Changchun 130025, China)(To whom correspondence should be addressed)   

  • Received:1996-05-28 Revised:1996-05-28 Online:1996-05-28 Published:2009-10-10

Abstract: Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233~1573 K, the wetting angles of CuNi-0~56 at pct Ti alloys on Si3N4 have been measured by the sessile drop method. With the increase of Ti content, the wetting angles decreased. The equilibrium wetting angle was 5° when Ti content ≥32 at pct.In the case of same Ti content, the activity of Ti in CuNiTi alloy was weaker than that in CuTi alloy The cross-section of the CuNiTi-Si3N4 interface and the elements distribution were examined by scanning electron microscope with X-ray wave-dispersion spectrometer, and the reaction products formed at the interface were determined by X-ray diffiaction analysis method.