J. Mater. Sci. Technol. ›› 2025, Vol. 221: 233-246.DOI: 10.1016/j.jmst.2024.09.040

• Research Article • Previous Articles     Next Articles

Enhancing strength and ductility of CuCrZr high-conductivity alloy via lamellar heterostructures on grain boundaries

Xinhao Zhanga, Xiaoxin Zhanga,b,*, Jun Zhanga, Xiaodong Huanga, Qingzhi Yana,*   

  1. aInstitute of Nuclear Materials, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;
    bState Key Laboratory of Nuclear Power Safety Technology and Equipment, University of Science and Technology Beijing, Beijing 100083, China
  • Received:2024-06-20 Revised:2024-09-05 Accepted:2024-09-05 Published:2024-10-28 Online:2024-10-28
  • Contact: *E-mail addresses: zhangxiaoxin2008@126.com (X. Zhang), qzyan@ustb.edu.cn (Q. Yan)

Abstract: Heterogeneous lamellar structure materials have attracted extensive attention due to their exceptional strength and ductility. In this study, Y element was introduced into CuCrZr alloys to adjust the liquid phase formation temperature of the CuZrY phase during the solution annealing process. By employing cold rolling deformation prior to annealing to elongate the grains, the liquid phase was promoted to wet the elongated grain boundaries during the annealing process, ultimately forming lamellar CuZrY heterostructures distributed along the grain boundaries. The heterogeneous lamellar structure, the grain boundary distribution characteristics, and the effect of Y on stacking fault energy enhanced the hetero-deformation induced working hardening, thereby improving both the strength and ductility of the CuCrZrY alloy. Besides, the investigated CuCrZrY alloy achieved an excellent combination of tensile strength, uniform elongation, electrical conductivity and thermal conductivity, with values of 527 MPa, 10.66 %, 83 % IACS and 335.5 W/(m K), respectively. Therefore, the method of controlling liquid phase temperature through composition adjustment and liquid phase infiltration path through grain deformation offers new possibilities for the design of heterogeneous lamellar structure materials.

Key words: CuCrZr, Heterogeneous structure, Back stress, Tensile properties, Electrical and thermal conductivity, Loading-unloading-reloading test