Single-crystallization of electrolytic copper foils

doi:10.1016/j.jmst.2023.07.039

Abstract

Abstract: Depending on the production process, copper (Cu) foils can be classified into two types, i.e., rolled copper (r-Cu) foils and electrolytic copper (e-Cu) foils. Owing to their high electrical conductivity and ductility at low cost, e-Cu foils are employed extensively in modern industries and account for more than 98% of the Cu foil market share. However, industrial e-Cu foils have never been single-crystallized due to their high density of grain boundaries, various grain orientations and vast impurities originating from the electrochemical deposition process. Here, we report a methodology of transforming industrial e-Cu foils into single crystals by facet copy from a single-crystal template. Different facets of both low and high indices are successfully produced, and the thickness of the single crystal can reach 500 µm. Crystallographic characterizations directly recognized the single-crystal copy process, confirming the complete assimilation impact from the template. The obtained single-crystal e-Cu foils exhibit remarkably improved ductility (elongation-to-fracture of 105% vs. 25%), fatigue performance (the average numbers of cycles to failure of 1600 vs. 200) and electrical property (electrical conductivity of 102.6% of the international annealed copper standard (IACS) vs. 98.5%) than original ones. This work opens up a new avenue for the preparation of single-crystal e-Cu foils and may expand their applications in high-speed, flexible, and wearable devices.

Key words: Electrolytic copper foil, Single-crystallization, Facet copy, Grain growth, Mechanical property

Xingguang Li, Mengze Zhao, Quanlin Guo, Chong Zhao, Mingchao Ding, Dingxin Zou, Zhiqiang Ding, Zhiqiang Zhang, Menglin He, Kehai Liu, Muhong Wu, Zhihong Zhang, Enge Wang, Ying Fu, Kaihui Liu, Zhibin Zhang. Single-crystallization of electrolytic copper foils[J]. J. Mater. Sci. Technol., 2024, 176: 112-118.

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