Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding

doi:10.1016/j.jmst.2022.12.012

J. Mater. Sci. Technol. ›› 2023, Vol. 149: 161-166.DOI: 10.1016/j.jmst.2022.12.012

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Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO₂ hybrid bonding

Qiushi Kang, Ge Li, Zhengda Li, Yanhong Tian, Chenxi Wang^*

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Received:2022-08-23 Revised:2022-11-29 Accepted:2022-12-04 Published:2023-06-20 Online:2023-02-03
Contact: *E-mail address: wangchenxi@hit.edu.cn (C. Wang)

Abstract

Qiushi Kang, Ge Li, Zhengda Li, Yanhong Tian, Chenxi Wang. Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO₂ hybrid bonding[J]. J. Mater. Sci. Technol., 2023, 149: 161-166.

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Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO₂ hybrid bonding

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