[1 ] A. Camposeo, N. Puccini, F. Fuso, M. Allegrini, E.
Arimondo and A. Tuissi: Appl. Sur. Sci., 2003, 208-
209, 518.
[2 ] Y. Tong, Y. Liu, J. Miao and L. Zhao: Scripta Mater.,
2005, 52, 983.
[3 ] D. Xu, L. Wang, G. Ding, Y. Zhou, A. Yu and B. Cai:
Sensors & Actuators A, 2001, 93, 87.
[4 ] Q. He, M.H. Hong, W.M. Huang, T.C. Chong, Y.Q.
Fu and H.J. Du: J. Micromech. Microeng., 2004, 14,
950.
[5 ] M. Vestel and D. Grummon: Mater. Sci. Eng. A,
2004, 378, 437.
[6 ] X. Wang and J.J. Vlassak: Scripta Mater., 2006, 54,
925.
[7 ] N.W. Botteril and D.M. Grant: Mater. Sci. Eng. A,
2004, 378, 424.
[8 ] Y. Fu, H. Du, W. Huang, S. Zhang and M. Hu: Sensors
and Actuators A, 2004, 112, 395.
[9 ] L.L. Stepan, D. Levi and G. Carman: J. Biomechani-
cal Eng.: Transaction of ASME, 2005, 127, 915.
[10] Y. Bellouard, T. Lehnert, J.E. Bidaux, T. Sidler, R.
Clavel and R. Gotthard: Mater. Sci. Eng. A, 1999,
273-275, 795.
[11] X. Wang, Y. Bellouard and J.J. Vlassak: Acta Mater.,
2005, 53, 4955.
[12] Y.S. Liu, D. Xu, B.H. Jiang, Z.Y. Yuan and P. Van
Houtte: J. Micromech. Microeng., 2005, 15, 575.
[13] Y.H. Li, F.L. Meng, D.L. Qiu, Y. Wang, W.T. Zheng
and Y.M. Wang: Chin. Phys., 2004, 13, 1315.
[14] S. Sanjabi, S.K. Sadrnezhaad, K.A. Yates and Z.H.
Barber: Thin Solid Films, 2005, 491, 190.
[15] F.M.H. Zarandi and K. Sadrnezhaad: Mater. Manuf.
Process., 1997, 12(6), 1093.
[16] Q. He, W.M. Huang, M.H. Hong, M.J. Wu, Y.Q. Fu,
T.C. Chong, F. Chellet and H.Q. Du: Smart Matter.
Struct., 2004, 13, 977. |