A novel mechanical degradation mechanism in Ag nanopaste/Au pad interface: Grain boundary diffusion-induced Kirkendall-like voids
Yiping Wang, Jiayun Feng, Zirui Tong, Peng Wu, Runze Wang, Xinyang Ma, Shang Wang, Jianchao Liang, Shuai Jin, Minghan Yu, Yanhong Tian
J. Mater. Sci. Technol.
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2026, (0): 15
-25
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DOI: 10.1016/j.jmst.2026.01.011
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