J Mater Sci Technol ›› 2003, Vol. 19 ›› Issue (02): 177-179.

• Research Articles • Previous Articles     Next Articles

Simulation on Grain Boundary Sliding during Superplastic Deformation Using Molecular Dynamics Method

Jitai NIU, Lihong HAN, Chonghao WOO   

  1. The National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China...
  • Received:1900-01-01 Revised:1900-01-01 Online:2003-03-28 Published:2009-10-10
  • Contact: Jitai NIU

Abstract: Grain growth and grain boundary sliding are the two main superplastic deformation mechanisms. In the paper, simulation work is focused on the sliding of a Σ13 (111) symmetric twist coincidence grain boundary, a Σ13 (110) asymmetric tilt coincidence grain boundary, and a Σ3 (110) symmetric tilt coincidence grain boundary in Al, and the energies of grain boundary for each of equilibrium configurations are computed. An embedded atom method (EAM) potential was used to simulate the atomic interactions in a bicrystal containing more than 2000 atoms. At 0 K, the relationships between total potential energy and time steps for 3 (111) symmetric twist coincidence grain boundary and Σ3(110) symmetric tilt coincidence grain boundary during sliding at 2 m/s represent the periodic characteristic. However, the relationship between total potential energy and time steps for Σ13 (110) asymmetric tilt coincidence grain boundary represents the damp surge characteristic. It is found that grain boundary sliding for Σ3 (110) symmetric tilt coincidence grain boundary is coupled with apparent grain boundary migration.

Key words: Aluminum, Grain boundary sliding, Superplastic deformation, MD simulation