Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

J Mater Sci Technol ›› 2003, Vol. 19 ›› Issue (Supl.): 189-192.

• Research Articles • Previous Articles Next Articles

Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

Guisheng ZOU, Jun YANG, Aaiping WU, Genghua HUANG, Deku ZHANG, Jialie REN, Qing WANG

Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

Received:1900-01-01 Revised:1900-01-01 Online:2003-12-28 Published:2009-10-10
Contact: Guisheng ZOU

Abstract

Abstract: Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. The effects of processing conditions on the microstructures and shear strength of the joints were investigated. When Ti foil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time, the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in the bonding zone. The strength of the joints increases significantly if the Ti foil is transformed into liquid solution and is mostly extruded out of the bonding zone. The same phenomena are found in the case when Ti/Ni/Ti multi-interlayers are used for bonding tungsten to CuCrZr alloy.

Key words: Tungsten, Copper, Multiple interlayers, Diffusion bonding

Guisheng ZOU, Jun YANG, Aaiping WU, Genghua HUANG, Deku ZHANG, Jialie REN, Qing WANG. Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers[J]. J Mater Sci Technol, 2003, 19(Supl.): 189-192.

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Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

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