J. Mater. Sci. Technol. ›› 2024, Vol. 195: 227-233.DOI: 10.1016/j.jmst.2023.11.080

• Letter • Previous Articles     Next Articles

Difunctional undulating interface optimizes the structure-comprehensive properties of graphene/CuNb composite with analogy-bicontinuous structure

Siyuan Guoa, Xiang Zhanga, Chunsheng Shia,b,*, Dongdong Zhaoa, Chunnian Hea,b, Naiqin Zhaoa,b,*   

  1. aSchool of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, China;
    bKey Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, Tianjin University, Tianjin 300350, China
  • Revised:2023-10-29 Published:2024-10-01 Online:2024-10-10
  • Contact: *School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, China. E-mail addresses: csshi@tju.edu.cn (C. Shi), nqzhao@tju.edu.cn (N. Zhao)

Abstract: Tailoring structure is of giant significance in achieving a synergy between mechanical properties-electrical conductivity (EC) of Cu matrix composites. This work contributes an in-depth understanding of undulating graphene-Cu interface architecture optimizing multiscale structure in graphene/CuNb composites fabricated by in situ synthesis integrated with powder metallurgy process. It was elucidated that the undulating graphene-Cu interface not only evidently ameliorates mesoscopic internal structure, but also elaborately modifies the interaction between the added phase and matrix, leading to prominent contribution to the mechanical properties through effective structural regulation as well as modulating dislocation accumulation/storage and crack deflection. Meanwhile, manipulating the skeleton of conductive pathways enables ameliorating the EC of composites. These findings can unfold brand new frontiers for alleviating themechanical-functional characteristics conflict of Cu matrix composites.

Key words: Metal matrix composites (MMC), Sintering, Rolling, Undulating graphene-Cu interface, Electrical properties