[1] M.McLean: Directionally Solidified Materials for HighTemperature Service, The Metals Society London,1983. [2] F.Garofalo: Fundamental of Creep and Creep Rupturein Wtals, The MacMillan Company New York, 1956. [3] F.L.VerSnyder and R.W.Guard: Thans. ASM, 1960,52, 485. [4]F.L.VerSnyder and M.E.Shank: Mater. Sci. Eng.,1970, 6, 213. [5] W.J.Evans and B.Wilshire: Met. Sci. J., 1970, 4, 89. [6] G.R.Leverant and B.H.Kear: Metall. Trans. A, 1970,1, 491. [7] G.R.Leverant, B.H.Kear and J.M.Oblak: Mitall.Thans. A, 1973, 4, 355. [8] R.A.MacKay and R.D.Maiey: Mitan. Trans. A, 1982,13A, 1747. [9]C.Carry and J.L.Strudel: Acta Metall., 1978, 26, 859. [10] M.V.Nathal and L.J.Ebert: Metall. Trans. A, 1985,16A, 427. [11] T.M.Pollock and A.S.Argon: Acta Metall. Mater.,1992, 40, 1. [12] H.Rouault-Rogez, M.Dupeux and M.Ignat: Acta Met-all. Mater., 1994, 42, 3137. [13] Rongzhang CHEN: J. Aero. Mater., 1993, 13, 47. (inChinese) [14] R.S.Mishra: Mater. Sci. Technol, 1995, 11, 341. [15] R.B.Scarlin: Metall. Thans. A, 1976, 7A, 1535. [16] J.C.Li: Acta Metall., 1963, 21, 1195. [17] W.J.Evans and B.Wilshire: hos. TMS-AIME, 1968,242, 1303. [18] D.Sidey and B.Wilshire: Met. Sci. J., 1969, 3, 56. [19] J.T.Guo, D.Ranucci and P.M.Strocchi: Metall. Trans.A, 1983, 14A, 2329. [20] V.Lupinc: Crep and Fatigue in High TemperatureAlloys, ed. J.Bressers, Applied Science Pub. Ltd.,London, 1981. [21] J.P.Dennison, P.D.Holmes and B.Wilshire: Mater.Sci. Eng., 1978, 33, 35. [22] B.Burton, I.G.Crossland and G.W.Greenwood:' Mit.Sci., 1980, 14, 134. [23] T.C.Chou and Y.T.Chou, In: C.C.Koch, C.T.Lin,N.S.Stoloff eds., High-Temperature Ordered Inter-metallic Alloys, Pittsburgh P A: MRS, 1985, 39, 461. [24] C.Yuan, J.T.Guo and H.C.Yang: to be submitted. [25] K.R.Williams and B.Wilshire: inter. Sci. Eng., 1977,27, 17. [26] F.C.Monkman and J.Grant: Pro c. ASTM, 1956, 56,593. [27] J.K.Tien: Resistance to Creep, Alloy and Microstruc-ture Design, ed. J.K.Tien and G.S.Ansell, AcademicPress, New York, 1976. [28] S.H.Ai, V.Lupinc and M.Maldili: Schota Metall.,1992, 26, 579. [29] A.H.Sherry and R.Pilkington: Miter. Sci. Eng., 1993,A172, 51. [30] Xiping GUO and Hengzhi FU: Mit. Eng., 1995, 6, 3.(in Chinese) [31] K.Aning and J.K.Tien: Mater. Sci. Eng., 1980, 43,23. |