[1] |
S.D. Ji, Q. Wen, Z.W. Li.
A novel friction stir diffusion bonding process using convex-vortex pin tools
[J]. J. Mater. Sci. Technol., 2020, 48(0): 23-30.
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[2] |
Peng Li, Shuai Wang, Yueqing Xia, Xiaohu Hao, Honggang Dong.
Diffusion bonding of AlCoCrFeNi2.1 eutectic high entropy alloy to TiAl alloy
[J]. J. Mater. Sci. Technol., 2020, 45(0): 59-69.
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[3] |
Ying Gong, Wenying Zhou, Zijun Wang, Li Xu, Yujia Kou, Huiwu Cai, Xiangrong Liu, Qingguo Chen, Zhi-Min Dang.
Towards suppressing dielectric loss of GO/PVDF nanocomposites with TA-Fe coordination complexes as an interface layer
[J]. J. Mater. Sci. Technol., 2018, 34(12): 2415-2423.
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[4] |
Li Fuping,Li Jinshan,Kou Hongchao,Zhou Lian.
Anisotropic Porous Ti6Al4V Alloys Fabricated by Diffusion Bonding: Adaption of Compressive Behavior to Cortical Bone Implant Applications
[J]. J. Mater. Sci. Technol., 2016, 32(9): 937-943.
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[5] |
Chao Zhang, Hong Li, Miaoquan Li.
Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion Bonding
[J]. J. Mater. Sci. Technol., 2016, 32(3): 259-264.
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[6] |
Chen Haiyan, Cao Jian, Song Xiaoguo, Liu Jiakun, Feng Jicai.
Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
[J]. J. Mater. Sci. Technol., 2014, 30(7): 722-730.
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[7] |
Shaily M. Bhola, Sukumar Kundu, Rahul Bhola, Brajendra Mishra, Subrata Chatterjee.
Electrochemical Study of Diffusion Bonded Joints between Micro-duplex Stainless Steel and Ti6Al4V Alloy
[J]. J. Mater. Sci. Technol., 2014, 30(2): 163-171.
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[8] |
H. Sabetghadam, A. Zarei Hanzaki, A. Araee, A. Hadian.
Microstructural Evaluation of 410 SS/Cu Diffusion-Bonded Joint
[J]. J Mater Sci Technol, 2010, 26(2): 163-169.
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[9] |
Jianying Zou,Yuyou Cui,Rui Yang.
Diffusion Bonding of Dissimilar Intermetallic Alloys Based on Ti2AlNb and TiAl
[J]. J Mater Sci Technol, 2009, 25(06): 819-824.
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[10] |
Bulent Kurt,Mustafa Ulutan.
Interfacial Microstructure of Diffusion Bonded Inconel 738 and Ferritic Stainless Steel Couple
[J]. J Mater Sci Technol, 2009, 25(04): 527-530.
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[11] |
Wei GUO, Xihua ZHAO, Minxia SONG, Jicai FENG, Biao YANG.
Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers
[J]. J Mater Sci Technol, 2006, 22(06): 817-820.
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[12] |
Jihua HUANG, Yueling DONG, Jiangang ZHANG, Yun WAN, Guoan ZHOU.
Reactive Diffusion Bonding of SiCp/Al Composites by Insert Powder Layers with Eutectic Composition
[J]. J Mater Sci Technol, 2005, 21(05): 779-781.
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[13] |
Wenbo HAN, Kaifeng ZHANG, Guofeng WANG, Xiaojun ZHANG.
Superplastic Forming and Diffusion Bonding for Sandwich Structure of Ti-6Al-4V Alloy
[J]. J Mater Sci Technol, 2005, 21(01): 60-62.
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[14] |
Wei GUO, Jitai NIU, Jinfan ZHAI, Changli WANG, Jie YU, Guangtao ZHOU.
Study on Non-interlayer Liquid Phase Diffusion Bonding for SiCp/ZL101 Aluminum Matrix Composite
[J]. J Mater Sci Technol, 2003, 19(Supl.): 88-90.
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[15] |
Guisheng ZOU, Jun YANG, Aaiping WU, Genghua HUANG, Deku ZHANG, Jialie REN, Qing WANG.
Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers
[J]. J Mater Sci Technol, 2003, 19(Supl.): 189-192.
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