J Mater Sci Technol ›› 2004, Vol. 20 ›› Issue (01): 109-112.

• Research Articles • Previous Articles     Next Articles

A New Model of Interfacial Physical Contact in Diffusion Bonding

Peng HE, Jicai FENG, Yiyu QIAN   

  1. National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China
  • Received:1900-01-01 Revised:1900-01-01 Online:2004-01-28 Published:2009-10-10
  • Contact: Peng HE

Abstract: Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.

Key words: Diffusion bonding, Physical contact, Interface layer