J. Mater. Sci. Technol. ›› 2012, Vol. 28 ›› Issue (7): 661-665.

• Reviews • 上一篇    下一篇

Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

张威1,1,钟颖2,王春青3   

  1. 1. Harbin Institute of Technology
    2. National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology
    3. 哈尔滨工业大学436信箱
  • 收稿日期:2011-05-04 修回日期:2011-12-01 出版日期:2012-07-28 发布日期:2012-07-28
  • 通讯作者: 张威
  • 基金资助:

    山东省科技发展计划

Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

Wei Zhang, Ying Zhong, Chunqing Wang   

  1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
  • Received:2011-05-04 Revised:2011-12-01 Online:2012-07-28 Published:2012-07-28
  • Contact: Wei Zhang
  • Supported by:

    the Scientific and Technological Development Projects in Shandong Province under Grant No. 2010GGX10307

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摘要： Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.

Abstract: Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.

Key words: Sn3.0Ag0.5Cu, Diamond, Composite solder, Chemical plating

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