J. Mater. Sci. Technol. ›› 2010, Vol. 26 ›› Issue (12): 1143-1147.

• Research Articles • 上一篇    下一篇

Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

刘葳   

  1. Shenyang National Laboratory for Materials Science Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
  • 收稿日期:2009-03-23 修回日期:2009-07-10 出版日期:2010-12-31 发布日期:2010-12-21
  • 通讯作者: 刘葳

Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

Wei Liu, Lei Zhang, K.J. Hsia J.K. Shang   

  1. 1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
    2) Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    3) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
  • Received:2009-03-23 Revised:2009-07-10 Online:2010-12-31 Published:2010-12-21
  • Supported by:

    the National Natural Science Foundation of China (No. 50501022) and the National Basic Research Program of China (No. 2004CB619306)

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关键词: wetting, reactive wetting, spreading, solder, thin film pattern, liquid film

Abstract: The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

Key words: Wetting, Reactive wetting, Spreading, Solder, Thin film pattern, Liquid film