J. Mater. Sci. Technol. ›› 2006, Vol. 22 ›› Issue (06): 817-820.

• 论文 • 上一篇    下一篇

Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers

郭伟   

  1. 吉林大学南岭校区材料学院
  • 收稿日期:2005-09-23 修回日期:2006-03-07 出版日期:2006-11-28 发布日期:2009-10-10
  • 通讯作者: Xihua ZHAO

Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers

Wei GUO, Xihua ZHAO, Minxia SONG, Jicai FENG, Biao YANG   

  1. Key Laboratory of Automobile Materials (Jilin University), Ministry of Education, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China...
  • Received:2005-09-23 Revised:2006-03-07 Online:2006-11-28 Published:2009-10-10
  • Contact: Xihua ZHAO

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Abstract: Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction (XRD). Interfacial microstructure of TiNi+CuTi3+®-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu (ss. Ni) solid solution forms between Ni/Cu interlayers. The thickness of reaction layer (TiNi) increases with bonding time by a parabolic law: y2=K0exp(-150000/RT)/t, and K0=2.9×10-7 m2/s is figured out from the experiment data.

Key words: Diffusion bonding, Microstructure, Interface, Ni/Cu interlayers