Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
Anil Kunwara,*(
), Yuri Amorim Coutinhoa, Johan Hektorb,c, Haitao Mad, Nele Moelansa
), Yuri Amorim Coutinhoa, Johan Hektorb,c, Haitao Mad, Nele Moelansa
.
Fig. 3.. Schematic sketch to classify the anode and cathode electrodes in the Cu/Sn/Cu joint undergoing electromigration (a), outline the relevant phase at the anode interfaces for computational model (b).
