A novel hole cold-expansion method and its effect on surface integrity of nickel-based superalloy
XianCao Ping, ZhangShuang Liu, Xue-Lin Lei*(), Run-Zi Wang, Xian-Cheng Zhang*(), Shan-Tung Tu

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Fig. 6.. TEM images of the topmost surface of (a) AR and (b) HCREP-3, and (c) 30 μm, (d) 60 μm deep layer of the HCREP-3.