Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite
Lei Lei1, Yu Su1, Leandro Bolzoni, Fei Yang*(
)
)
.
Fig. 6.. (a) Thermal conductivity and thermal diffusivity of hot-pressed Cu and Cu-Ti alloy, and Cu-Ti/Dia-0, Cu-Ti/Dia-1, and Cu-Ti/Dia-2 composites, (b) thermal conductivity comparison between current research and published papers.
