Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite
Lei Lei1, Yu Su1, Leandro Bolzoni, Fei Yang*(
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Fig. 5.. Interface characteristics of copper-Ti/diamond. (a) Representative TEM image; (b) and (c) HRTEM images recorded at the marked b and c regions in (a); (d), (e) and (f) HRTEM images recorded at the marked d, e, f regions in (b) and (c); and (g) HRTEM images recorded at the marked g region in (a).
