Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite

Lei Lei, Yu Su, Leandro Bolzoni, Fei Yang

Table 1 The heat treatment parameters for the encapsulated specimens.

Sample Heating rate (℃/min) Temperature (℃) Holding time (h) Cooling rate (℃/min) Cu-Ti/Dia-1 30 800 1 5 Cu-Ti/Dia-2 5 800 2 5