Two-stage Hall-Petch relationship in Cu with recrystallized structure

Y.Z. Tian^a^,^*(

), Y.P. Ren^b, S. Gao^c^,^d, R.X. Zheng^e, J.H. Wang^f, H.C. Pan^a, Z.F. Zhang^g^,^h, N.T suji^c^,^d, G.W. Qin^b

Fig. 2.. Tensile engineering stress-strain curves of pure Cu processed by (a) cold rolling and annealing, (b) HPT and annealing [17] and (c) tensile engineering stress-strain curves of Cu7Ag alloy processed by HPT and annealing [14].