Two-stage Hall-Petch relationship in Cu with recrystallized structure
Y.Z. Tiana,*(
), Y.P. Renb, S. Gaoc,d, R.X. Zhenge, J.H. Wangf, H.C. Pana, Z.F. Zhangg,h, N.T sujic,d, G.W. Qinb
), Y.P. Renb, S. Gaoc,d, R.X. Zhenge, J.H. Wangf, H.C. Pana, Z.F. Zhangg,h, N.T sujic,d, G.W. Qinb
.
Fig. 1.. (a, b) Backscattered images of pure Cu with representative grain sizes, (c) TEM image of the recrystallized Cu7Ag alloy with mean grain size of 177 nm and (d) HRTEM image from the grain interior of the recrystallized Cu7Ag alloy.
