Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints
Hao Zhang1, Qing-Sheng Zhu1, Zhi-Quan Liu1,*, Li Zhang2, Hongyan Guo2, Chi-Ming Lai2
Fig. 5. Relationship between the thickness of IMC and time in SnAgCuFe-Ni systems under high temperature storage: a 150 #cod#x000b0;C, b 175 #cod#x000b0;C, c 200 #cod#x000b0;C, d relationship between 1 T and ln k .