Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Hao Zhang¹, Qing-Sheng Zhu¹, Zhi-Quan Liu^1,^*, Li Zhang², Hongyan Guo², Chi-Ming Lai²

Fig. 4. Interfacial morphology of Fe-75Ni solder joint after different days' aging in 200 #cod#x000b0;C: a 1 day, b 15 days, c 27 days, d 1 day microscopic morphology, e 4 days microscopic morphology.