Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Hao Zhang¹, Qing-Sheng Zhu¹, Zhi-Quan Liu^1,^*, Li Zhang², Hongyan Guo², Chi-Ming Lai²

Fig. 3. Interfacial morphology of different Fe-Ni solder joints after 1, 9 and 27 days' aging in 150 #cod#x000b0;C: a-c 1 day, d-f 9 days, g-i 27 days.