Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Hao Zhang¹, Qing-Sheng Zhu¹, Zhi-Quan Liu^1,^*, Li Zhang², Hongyan Guo², Chi-Ming Lai²

Fig. 6. SEM images of interfacial cracks caused by temperature cycling: a and c Fe-75Ni solder joint after 32 cycles, b and d Fe-30Ni solder joint after 320 cycles.