Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Hao Zhang¹, Qing-Sheng Zhu¹, Zhi-Quan Liu^1,^*, Li Zhang², Hongyan Guo², Chi-Ming Lai²

Fig. 1. Interfacial morphology of different Fe-Ni UBM barrier layers after reflow: a Fe-75Ni, b Fe-50Ni, c Fe-30Ni.