Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration

M.L. Huang¹, Z.J. Zhang¹, H.T. Ma¹, L.D. Chen²

Fig. 6 shows the microstructural evolution of the CuSnNi interconnect undergoing EM with electrons flowing from the Ni to the Cu the diffusion of Cu atoms is called #cod#x0201c;upwind diffusion#cod#x0201d; while that of Ni atoms is called #cod#x0201c;downwind diffusion#cod#x0201d;.
Fig. 6 SEM images of CuSnNi interconnects after EM electrons flowing from Ni to Cu for various time: a and b 10 min; c and d 1 h; e and f 2 h; g and h 4 h.