Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
M.L. Huang1 
, Z.J. Zhang1 , H.T. Ma1 , L.D. Chen2
, Z.J. Zhang
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration |
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M.L. Huang
, Z.J. Zhang |
| Fig. 4 Growth kinetics of interfacial IMCs during liquid-solid interfacial reaction at 250 #cod#x000b0;C: a in linear scale; b in logarithmic scale, where h is the thickness of interfacial IMC and t is time. |
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